Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/19/2016
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Application #:
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14464875
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Filing Dt:
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08/21/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Inventors:
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Kenji Matsumoto, Tatsufumi Hamada
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR SUPPRESING WIRING MATERIAL FROM BEING DIFFUSED INTO INSULATING FILM, STORAGE MEDIUM AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| PEARNE & GORDON LLP |
| 1801 EAST 9TH STREET |
| SUITE 1200 |
| CLEVELAND, OH 44114-3108 |
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