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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14369411
Filing Dt:
06/27/2014
Publication #:
20140377453
Pub Dt:
12/25/2014
Inventors:
Chan Sup Park, Rae-Hong Cho, Dong Hyon Kim, Kyung Ho Park, Sang-Kwon Han, Chong Soo Park et al
Title:
Insulating Adhesive Composition for Metal-Based Copper Clad Laminate (MCCL), Coated Metal Plate Using Same, and Method for Manufacturing Same
Assignment: 1
Reel/Frame:
033628/0608Recorded: 08/28/2014Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, CHAN SUP
Exec Dt:
07/04/2014
CHO, RAE-HONG
Exec Dt:
07/14/2014
KIM, DONG HYON
Exec Dt:
07/07/2014
PARK, KYUNG HO
Exec Dt:
07/15/2014
HAN, SANG-KWON
Exec Dt:
07/02/2014
PARK, CHONG SOO
Exec Dt:
07/15/2014
LEE, BAE GEUN
Exec Dt:
07/14/2014
KIM, JUNG BONG
Exec Dt:
07/14/2014
HAN, JAE MAN
Exec Dt:
07/15/2014
SHIN, TAE KYOO
Exec Dt:
07/15/2014
BAE, DAE CHUL
Exec Dt:
07/02/2014
Assignee:
POSCO
6261 DONGHAEAN-RO, NAM-GU,
GYEONGSANGBUK-DO
POHANG-SI, KOREA, REPUBLIC OF 790-300
Correspondent:
THE WEBB LAW FIRM, P.C.
ONE GATEWAY CENTER
420 FT. DUQUESNE BLVD, SUITE 1200
PITTSBURGH, PA 15222

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