Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14485207
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Filing Dt:
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09/12/2014
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Publication #:
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Pub Dt:
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01/01/2015
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Inventors:
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Ian D. Melville, Richard F. Indyk, Shigefumi Okada
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Title:
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STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-11 OMORI-KITA 2-CHOME |
| OTA-KU |
| TOKYO, JAPAN 143-8580 |
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| SCULLY, SCOTT, MURPHY & PRESSER, P.C. |
| 400 GARDEN CITY PLAZA |
| SUITE 300 |
| GARDEN CITY, NY 11530 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| SCULLY, SCOTT, MURPHY & PRESSER, P.C. |
| 400 GARDEN CITY PLAZA |
| SUITE 300 |
| GARDEN CITY, NY 11530 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF INVENTORS PREVIOUSLY RECORDED AT REEL: 033733 FRAME: 0275. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| SCULLY, SCOTT, MURPHY & PRESSER, P.C. |
| 400 GARDEN CITY PLAZA |
| SUITE 300 |
| GARDEN CITY, NY 11530 |
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