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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/26/2019
Application #:
14375138
Filing Dt:
07/29/2014
Publication #:
Pub Dt:
01/01/2015
Inventors:
Takahiro Ito, Junya Komano, Makoto Imahori, Tetsunobu Kuramoto, Yuuji Minamibori
Title:
MOLDING PACKAGING MATERIAL AND METHOD FOR PRODUCING SAME
Assignment: 1
Reel/Frame:
034864/0010Recorded: 02/02/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2014
Exec Dt:
01/26/2015
Exec Dt:
12/26/2014
Exec Dt:
12/08/2014
Exec Dt:
12/01/2014
Assignees:
31, SUZUKAWA,
ISEHARA-SHI, KANAGAWA, JAPAN 259-1146
1-14-1, NISHI SHIMBASHI
MINATO-KU, TOKYO, JAPAN 105-8419
Correspondent:
KEATING & BENNETT, LLP
1800 ALEXANDER BELL DRIVE
SUITE 200
RESTON, VA 20191
Assignment: 2
Reel/Frame:
064374/0937Recorded: 07/25/2023Pages: 27
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2023
Assignee:
60 KIYOSAKICHO
HIKONE-SHI, SHIGA, JAPAN 529-1156
Correspondent:
KEATING & BENNETT, LLP
1800 ALEXANDER BELL DR.
SUITE 200
RESTON, VA 20191

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