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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9988264
Issue Dt:
06/05/2018
Application #:
14489495
Filing Dt:
09/18/2014
Publication #:
20150004732
Pub Dt:
01/01/2015
Inventors:
Bang-Chiang Lan, Li-Hsun Ho, Wei-Cheng Wu, Hui-Min Wu, Min Chen, Tzung-I Su et al
Title:
METHOD OF FABRICATING INTEGRATED STRUCTURE FOR MEMS DEVICE AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
033762/0956Recorded: 09/18/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAN, BANG-CHIANG
Exec Dt:
03/21/2008
HO, LI-HSUN
Exec Dt:
03/21/2008
WU, WEI-CHENG
Exec Dt:
03/21/2008
WU, HUI-MIN
Exec Dt:
03/21/2008
CHEN, MIN
Exec Dt:
03/21/2008
SU, TZUNG-I
Exec Dt:
03/21/2008
HUANG, CHIEN-HSIN
Exec Dt:
03/21/2008
Assignee:
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU CITY, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116
Assignment: 2
Reel/Frame:
056991/0292Recorded: 07/26/2021Pages: 37
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
UNITED MICROELECTRONICS CORPORATION
Exec Dt:
06/18/2021
Assignee:
MARLIN SEMICONDUCTOR LIMITED
BRACKEN ROAD, SANDYFORD
FIRST FLOOR, BLACKTHORN EXCHANGE
DUBLIN, IRELAND D18 P3Y9
Correspondent:
LONGITUDE LICENSING LTD
BRACKEN ROAD, SANDYFORD
FIRST FLOOR, BLACKTHORN EXCHANGE
DUBLIN, D18 P3Y9 IRELAND

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