Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13941644
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Filing Dt:
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07/15/2013
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Publication #:
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Pub Dt:
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01/15/2015
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Inventors:
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Donald R. Dignam, Eric R. Ao, Stephen J. Flint
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Title:
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HIGH SPEED VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORP- ENDICOTT DRAFTING CENTER |
| 650 HARRY ROAD |
| L2PA/J2C |
| SAN JOSE, CA 95120 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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