Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/27/2016
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Application #:
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14315834
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Filing Dt:
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06/26/2014
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Publication #:
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Pub Dt:
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01/15/2015
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Inventors:
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Ke Pu, Li Ling, Chun C. Wang, Wei Feng Zhang
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Title:
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WAVE SOLDERING APPARATUS AND NOZZLE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM MICROELECTRONICS INTELLECTUAL |
| 1000 RIVER STREET |
| 972 E |
| ESSEX JUNCTION, VT 05452 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01, NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23/F, LINCOLN HOUSE, 979 KING'S ROAD |
| QUARRY BAY, HONG KONG |
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| BECKY A. WILLIAMS |
| 222 W. MERCHANDISE MART PLAZA |
| SUITE 1800 |
| CHICAGO, IL 60654 |
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