Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14383020
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Filing Dt:
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09/04/2014
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Publication #:
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Pub Dt:
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01/15/2015
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Inventors:
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Toshiaki Ezaki, Shusuke Yoshihara, Mitsuru Nakamura
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Title:
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THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-18, NAKANOSHIMA 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8288 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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