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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14381887
Filing Dt:
08/28/2014
Publication #:
Pub Dt:
01/15/2015
Inventors:
Ichitaro Okamoto, Mamoru Nakamura, Hiroshi Uragami, Keita Mizuma, Naoki Takada et al
Title:
METHOD OF MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT AND APPARATUS FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC COMPONENT
Assignment: 1
Reel/Frame:
033633/0379Recorded: 08/28/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/25/2014
Exec Dt:
08/25/2014
Exec Dt:
08/25/2014
Exec Dt:
08/25/2014
Exec Dt:
08/25/2014
Exec Dt:
08/25/2014
Assignee:
5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU,
KYOTO-SHI, KYOTO, JAPAN 601-8105
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, P.C.
4000 LEGATO ROAD
SUITE 310
FAIRFAX, VA 22033

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