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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/02/2018
Application #:
13945217
Filing Dt:
07/18/2013
Publication #:
Pub Dt:
01/22/2015
Inventor:
Jing-Cheng Lin
Title:
BONDED SEMICONDUCTOR STRUCTURES
Assignment: 1
Reel/Frame:
030826/0251Recorded: 07/18/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/08/2013
Assignee:
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
STEVEN J. LAUREANTI
40 NORTH CENTER STREET, SUITE 200
MESA, AZ 85201

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