Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14368760
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Filing Dt:
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06/25/2014
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Publication #:
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Pub Dt:
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01/29/2015
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Inventors:
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Sakie Okada, Motoki Koroki, Hiroaki Iseki, Hiromasa Hayashi, Taro Itoyama et al
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Title:
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Solder Paste
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| 1-1, SHOWA-CHO |
| KARIYA-SHI |
| AICHI, JAPAN 448-8661 |
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| DONALD B. HASLETT |
| 601 SW SECOND AVENUE, SUITE 1600 |
| CHERNOFF VILHAUER MCCLUNG & STENZEL LLP |
| PORTLAND, OR 97204-3157 |
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