Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14340850
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Filing Dt:
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07/25/2014
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Publication #:
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Pub Dt:
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01/29/2015
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Inventors:
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Kazuki HANADA, Yasuhiro TAKASE, Kazunori KITAMURA
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Title:
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RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION METHOD, AND MEMBER HAVING SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 31-16, HORIFUNE 1-CHOME, KITA-KU |
| TOKYO, JAPAN 114-0004 |
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| YOUNG & THOMPSON |
| 209 MADISON STREET |
| SUITE 500 |
| ALEXANDRIA, VA 22314 |
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