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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/09/2017
Application #:
14373900
Filing Dt:
07/22/2014
Publication #:
Pub Dt:
02/05/2015
Inventors:
Hiroki Yamamoto, Yasuhiro Kondo, Hiroshi Tamagawa, Katsuya Matsuura
Title:
CHIP COMPONENT
Assignment: 1
Reel/Frame:
033368/0163Recorded: 07/22/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2014
Exec Dt:
06/19/2014
Exec Dt:
06/19/2014
Exec Dt:
06/19/2014
Assignee:
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI
KYOTO, JAPAN 615-8585
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST., N.W., SUITE 500
WASHINGTON, DC 20005

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