Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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14451215
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Filing Dt:
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08/04/2014
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Publication #:
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Pub Dt:
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02/05/2015
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Inventor:
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Hirokazu Nanjo
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Title:
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ELECTRONIC COMPONENT BUILT-IN MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-5-1, KIBA, KOTO-KU |
| TOKYO, JAPAN 135-8512 |
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| WESTERMAN, HATTORI, DANIELS&ADRIAN, LLP. |
| 1250 CONNECTICUT AVE., NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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