Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
14519590
|
Filing Dt:
|
10/21/2014
|
Publication #:
|
|
Pub Dt:
|
02/05/2015
| | | | |
Inventors:
|
Hanyi Ding, Gary R. Hill, Richard S. Graf, Wayne H. Woods JR.
|
Title:
|
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND RELATED METHOD
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
|
|
|
HOFFMAN WARNICK LLC |
540 BROADWAY |
4TH FLOOR |
ALBANY, NY 12207 |
|
|
Search Results as of:
05/21/2024 02:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|