Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/12/2016
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Application #:
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14521456
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Filing Dt:
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10/22/2014
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Publication #:
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Pub Dt:
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02/12/2015
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Inventors:
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Hsin-Yu Chen, Home-Been Cheng, Yu-Han Tsai, Ching-Li Yang
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Title:
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Through silicon via structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BRACKEN ROAD, SANDYFORD |
| FIRST FLOOR, BLACKTHORN EXCHANGE |
| DUBLIN, IRELAND D18 P3Y9 |
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| LONGITUDE LICENSING LTD |
| BRACKEN ROAD, SANDYFORD |
| FIRST FLOOR, BLACKTHORN EXCHANGE |
| DUBLIN, D18 P3Y9 IRELAND |
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