Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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14531263
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Filing Dt:
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11/03/2014
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Publication #:
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Pub Dt:
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02/19/2015
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Inventors:
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YI-XIANG WANG, KENICHI KANAI, JUYING DOU
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Title:
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WAFER GROUNDING AND BIASING METHOD, APPARATUS, AND
APPLICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F, NO.18, PUDING RD., EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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