Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14385779
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Filing Dt:
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09/17/2014
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Publication #:
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Pub Dt:
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02/19/2015
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Inventors:
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Dirk Tews, Fabian Michalik, Belén Gil Ibánez, Lutz Brandt, Meng Che Hsieh, Zhiming Liu
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Title:
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METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERASMUSSTRASSE 20 |
| BERLIN, GERMANY 10553 |
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| RENNER OTTO BOISSELLE & SKLAR, LLP |
| 1621 EUCLID AVENUE |
| NINETEENTH FLOOR |
| CLEVELAND, OH 44115 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 745 7TH AVENUE |
| NEW YORK, NEW YORK 10019 |
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| JAVIER J. RAMOS |
| 1850 K STREET, NW, SUITE 1100 |
| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| WASHINGTON, DC 20006 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| ERASMUSSTRASSE 20 |
| BERLIN, GERMANY |
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| 1750 OVERVIEW DRIVE |
| ROCK HILL, SOUTH CAROLINA 29730 |
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| MONICA ARNOLD, ESQ. |
| 2029 CENTURY PARK EAST, 33RD FLOOR |
| MILBANK, LLP |
| LOS ANGELES, CA 90067 |
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