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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/12/2016
Application #:
14388560
Filing Dt:
09/26/2014
Publication #:
Pub Dt:
02/26/2015
Inventors:
Hiroya Ishizuka, Yoshiyuki Nagatomo, Toshiyuki Nagase, Masakazu Edo, Yoshirou Kuromitsu et al
Title:
POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE WITH HEAT SINK
Assignment: 1
Reel/Frame:
033830/0658Recorded: 09/26/2014Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/05/2014
Exec Dt:
09/05/2014
Exec Dt:
09/05/2014
Exec Dt:
09/05/2014
Exec Dt:
09/05/2014
Exec Dt:
09/05/2014
Assignee:
3-2, OTEMACHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8117
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O BOX 55874
BOSTON, MA 02205

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