Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/30/2017
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Application #:
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14475249
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Filing Dt:
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09/02/2014
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Publication #:
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Pub Dt:
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03/05/2015
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Inventors:
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Takahiro Hattori, Daisuke Soma, lsamu Sato
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Title:
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Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| DONALD B. HASLETT, ESQ. |
| 601 SW SECOND AVENUE, SUITE 1600 |
| CHERNOFF VILHAUER MCCLUNG & STENZEL LLP |
| PORTLAND, OR 97204-3157 |
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