Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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14011772
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Filing Dt:
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08/28/2013
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Publication #:
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Pub Dt:
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03/05/2015
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Inventors:
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Peter Ossimitz, Juergen Schaefer, Liu Chen, Markus Dinkel, Stefan MacHeiner
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Title:
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Overmolded substrate-chip arrangement with heat sink
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| CLIFFORD B. PERRY |
| 270 N. EL CAMINO REAL |
| NO. F-347 |
| ENCINITAS, CA 92024 |
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