Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13987871
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Filing Dt:
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09/11/2013
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Publication #:
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Pub Dt:
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03/12/2015
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Inventors:
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Christopher S. Gudeman, Prosenjit Sen
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Title:
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Method for forming through wafer vias
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 75 ROBIN HILL ROAD |
| GOLETA, CALIFORNIA 93117 |
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| JAQUELIN K. SPONG |
| 2139 DOMINION WAY |
| FALLS CHURCH, VA 22043 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 2240 B STREET, BUILDING 11 |
| WPAFB, OHIO 45433 |
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| KAREN C GULLEY |
| 2240 B STREET, BUILDING 11 |
| WPAFB, OH 45433 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 812 ANACAPA STREET, SUITE A |
| SANTA BARBARA, CALIFORNIA 93101 |
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| PATTY CHENG |
| 2625 MIDDLEFIELD ROAD, SUITE 215 |
| PALO ALTO, CA 94306 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 75 ROBIN HILL ROAD |
| GOLETA, CALIFORNIA 93117 |
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| PATTY CHENG |
| 2625 MIDDLEFIELD RD., #215 |
| PALO ALTO, CA 94306 |
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