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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14390207
Filing Dt:
10/02/2014
Publication #:
Pub Dt:
03/19/2015
Inventors:
Yasushi Funakoshi, Takashi Nakatani, Tetsuya Yoshimoto
Title:
BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE
Assignment: 1
Reel/Frame:
034222/0039Recorded: 11/20/2014Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/2014
Exec Dt:
07/07/2014
Exec Dt:
06/27/2014
Assignee:
3-7, HIRANOMACHI 1-CHOME, CHUO-KU,
OSAKA-SHI, OSAKA, JAPAN 541-0046
Correspondent:
KRATZ, QUINTOS & HANSON, LLP
4TH FLOOR
1420 K STREET, N.W.
WASHINGTON, DC 20005

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