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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/12/2016
Application #:
14127187
Filing Dt:
12/18/2013
Publication #:
Pub Dt:
03/19/2015
Inventors:
Takashi Sunaga, Noboru Kaneko, Osamu Miyoshi
Title:
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
031924/0110Recorded: 12/18/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/04/2013
Exec Dt:
12/04/2013
Exec Dt:
12/04/2013
Assignee:
6-3, OHSAKI 1-CHOME
SHINAGAWA-KU, TOKYO, JAPAN 141-8560
Correspondent:
CROWELL & MORING LLP
P.O. BOX 14300
INTELLECTUAL PROPERTY DEPARTMENT
WASHINGTON, DISTRICT OF COLUMBIA 200444300
Assignment: 2
Reel/Frame:
037419/0464Recorded: 01/04/2016Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE COMBINED ASSIGNMENT AND DECLARATION INSIDE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 031924 FRAME: 0110. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
12/04/2013
Exec Dt:
12/04/2013
Exec Dt:
12/04/2013
Assignee:
6-3, OHSAKI 1-CHOME
SHINAGAWA-KU, TOKYO, JAPAN 141-8560
Correspondent:
CROWELL & MORING LLP
PO BOX 14300
WASHINGTON, DC 20044

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