Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/08/2016
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Application #:
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14556298
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Filing Dt:
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12/01/2014
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Publication #:
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Pub Dt:
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03/26/2015
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Inventors:
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GREGORY GEORGE, HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI et al
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Title:
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METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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430 INDIO WAY |
SUNNYVALE, CALIFORNIA 94085 |
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JOHN E. KIND |
FENWICK & WEST LLP |
801 CALIFORNIA STREET |
MOUNTAIN VIEW, CA 94041 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCHLEISSHEIMER STR. 90 |
GARCHING, GERMANY 85748 |
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JOHN E. KIND |
FENWICK & WEST LLP |
801 CALIFORNIA STREET |
MOUNTAIN VIEW, CA 94041 |
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