Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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14576199
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Filing Dt:
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12/19/2014
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Publication #:
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Pub Dt:
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04/16/2015
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Inventors:
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Han-Hsiang Lee, DA-JUNG CHEN, YI-CHENG LIN
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Title:
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.2, RESEARCH & DEVELOPMENT 2ND RD., SCIENCE PARK |
| HSINCHU, TAIWAN |
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| MIN-LEE TENG |
| 7F-2, NO. 79, SEC.2, ROOSEVELT RD. |
| TAIPEI, TAIWAN |
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