Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/10/2015
|
Application #:
|
14590383
|
Filing Dt:
|
01/06/2015
|
|
Publication #:
|
|
Pub Dt:
|
04/30/2015
| | | | |
|
Inventors:
|
Jae-yong Park, Jun-young Ko, Heui-seog Kim, Ho-geon Song
|
|
Title:
|
METHOD OF MOLDING SEMICONDUCTOR PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 129 SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-742 |
|
|
|
|
| ONELLO & MELLO LLP |
| THREE BURLINGTON WOODS DRIVE |
| SUITE 203 |
| BURLINGTON, MA 01803-4532 |
|
|
Search Results as of:
06/18/2024 08:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
