Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2016
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Application #:
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14073365
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Filing Dt:
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11/06/2013
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Publication #:
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Pub Dt:
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05/07/2015
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Inventors:
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Hsin-Ying LIN, Hsien-Cheng WANG, Fu-Kai YANG, Audrey Hsiao-Chiu HSU, Mei-Yun WANG et al
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Title:
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INTEGRATED CIRCUIT STRUCTURE WITH THINNED CONTACT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| BIRCH, STEWART, KOLASCH, & BIRCH, LLP. |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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