Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14597946
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Filing Dt:
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01/15/2015
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Publication #:
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Pub Dt:
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05/07/2015
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Inventor:
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Anca Stefanescu
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Title:
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SYSTEMS AND METHODS FOR ULTRASONICALLY CLEAVING A BONDED WAFER PAIR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 501 PEARL DRIVE |
| ST PETERS, MISSOURI 63376 |
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| RICHARD A. SCHUTH (SUNEDISON) ARMSTRONG |
| 7700 FORSYTH BOULEVARD |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 9 BATTERY ROAD |
| #15-01, STRAITS TRADING BUILDING |
| SINGAPORE, SINGAPORE 049 910 |
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| RICHARD A SCHUTH (SUNEDISON) ARMSTRONG |
| 7700 FORSYTH BOULEVARD |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
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05/22/2024 09:48 AM
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