Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14575639
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Filing Dt:
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12/18/2014
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Publication #:
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Pub Dt:
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05/21/2015
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Inventors:
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Zheng ZOU, Hai CONG, Yun Ling TAN, Lup San LEONG, Alex Kai Hung SEE, Xuesong RAO, Huang LIU
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Title:
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METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| DITTHAVONG & STEINER, P.C. |
| 44 CANAL CENTER PLAZA SUITE 322 |
| ALEXDANRIA, VA 22314 |
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Assignment:
2
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| 1100 NORTH MARKET STREET |
| WILMINGTON, DELAWARE 19801 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| PO BOX 309, UGLAND HOUSE |
| MAPLES CORPORATE SERVICES LIMITED |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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