Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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14558089
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Filing Dt:
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12/02/2014
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Publication #:
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Pub Dt:
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06/04/2015
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Inventors:
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Keun Soo KIM, Jung Hwan BANG, Hyuck Mo LEE, Ja Hyun KOO, Hui Joong KIM, Sung Jae HONG et al
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Title:
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LEAD FREE SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 405, GEUMEO-RO, POGOK-EUP, CHEOIN-GU |
| YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 449-812 |
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| 20, HOSEO-RO 79BEON-GIL, BAEBANG-EUP, ASAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 336-795 |
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| 291, DAEHAK-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-338 |
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| 89, YANGDAEGIRO-GIL, IPJANG-MYEON, SEOBUK-GU |
| CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 331-822 |
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| 25, SAENARI-RO, BUNDANG-GU, SEONGNAM-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 463-816 |
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| C. FREDERICK KOENIG III |
| VOLPE AND KOENIG, P.C. |
| 30 SOUTH 17TH STREET, UNITED PLAZA |
| PHILADELPHIA, PA 19103 |
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