Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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14188161
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Filing Dt:
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02/24/2014
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Publication #:
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Pub Dt:
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06/04/2015
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Inventors:
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Tae Hyun Kim, Heung Woo Park
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Title:
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MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN 3-DONG, YEONGTONG-GU,SUWON-SI |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY LLP |
| 5670 WILSHIRE BLVD. |
| SUITE 2100 |
| LOS ANGELES, CA 90036 |
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