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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/14/2017
Application #:
14554088
Filing Dt:
11/26/2014
Publication #:
Pub Dt:
06/04/2015
Inventors:
Sayuri Hada, Akihiro Horibe, Keiji Matsumoto
Title:
METHOD, APPARATUS, AND STRUCTURE FOR DETERMINING INTERPOSER THICKNESS
Assignment: 1
Reel/Frame:
034266/0812Recorded: 11/26/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/20/2014
Exec Dt:
11/20/2014
Exec Dt:
11/20/2014
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION - ENDICOTT DRAFTING CENT
294 ROUTE 100
P.O. BOX 100
SOMERS, NY 10589-0100

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