Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/31/2016
|
Application #:
|
14096217
|
Filing Dt:
|
12/04/2013
|
|
Publication #:
|
|
Pub Dt:
|
06/04/2015
| | | | |
|
Inventors:
|
Ming-Tung Wu, Yuan- Chih Hsieh, Chia-Shiung Tsai, Lan-Lin Chao
|
|
Title:
|
TRANSFER MODULE FOR BOWED WAFERS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
|
|
|
|
| ESCHWEILER & ASSOCIATES, LLC. |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BANK BUILDING |
| CLEVELAND, OH 44114 |
|
|
Search Results as of:
05/10/2024 02:54 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
