Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14337571
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Filing Dt:
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07/22/2014
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Publication #:
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Pub Dt:
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06/04/2015
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Inventors:
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Masato KAJINAMI, Sang-Yoon KIM, Byeong-Kuk PARK, Jae Bong SHIN, Byung Joon LEE et al
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Title:
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SEMICONDUCTOR MANUFACTURING APPARATUSES COMPRISING BONDING HEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129 SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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