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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9403145
Issue Dt:
08/02/2016
Application #:
14642704
Filing Dt:
03/09/2015
Publication #:
20150174552
Pub Dt:
06/25/2015
Inventors:
Hua BAI, Ravindra S. DIXIT, Curtis D. MODTLAND, John G. PENDERGAST JR. et al
Title:
ORGANOMETALLIC COMPOUND PREPARATION
Assignment: 1
Reel/Frame:
041278/0128Recorded: 02/16/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WARE, ROBERT A
Exec Dt:
09/05/2012
SHENAI-KHATKHATE, DEODATTA VINAYAK
Exec Dt:
09/05/2012
AMAMCHYAN, ARTASHES
Exec Dt:
09/11/2012
CROUCH, KENNETH M
Exec Dt:
09/05/2012
POLCARI, ROBERT F
Exec Dt:
09/11/2012
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET
MARLBOROUGH, MASSACHUSETTS 01752
Correspondent:
KRISTIE ELLISON
2040 DOW CENTER
MIDLAND, MI 48674
Assignment: 2
Reel/Frame:
041277/0868Recorded: 02/16/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DIXIT, RAVINDRA S
Exec Dt:
09/06/2012
BAI, HUA
Exec Dt:
09/07/2012
MODTLAND, CURTIS D
Exec Dt:
09/17/2012
PENDERGAST, JOHN G, JR
Exec Dt:
09/06/2012
CHRISTENSON, CHRISTOPHER P
Exec Dt:
09/11/2012
Assignee:
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER
MIDLAND, MICHIGAN 48674
Correspondent:
KRISTIE ELLISON
2040 DOW CENTER
MIDLAND, MI 48674

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