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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9836236
Issue Dt:
12/05/2017
Application #:
14412205
Filing Dt:
12/31/2014
Publication #:
20150186067
Pub Dt:
07/02/2015
Inventors:
Hong Hu, Jianjun Zhang, Ronghua Pan, Qingming Shu, Sai Zhang, Jiang Liu
Title:
SPI INTERFACE ENHANCED FLASH CHIP AND CHIP PACKAGING METHOD
Assignment: 1
Reel/Frame:
034604/0701Recorded: 12/31/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHU, QINGMING
Exec Dt:
11/14/2014
HU, HONG
Exec Dt:
11/14/2014
ZHANG, SAI
Exec Dt:
11/14/2014
ZHANG, JIANJUN
Exec Dt:
11/14/2014
LIU, JIANG
Exec Dt:
11/14/2014
PAN, RONGHUA
Exec Dt:
11/14/2014
Assignee:
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
SUITE 01-15, A12, TIANGONG BUILDING
XUEYUAN ROAD NO. 30, HAIDIAN DISTRICT
BEIJING, CHINA 100083
Correspondent:
GOKALP BAYRAMOGLU
8275 SOUTH EASTERN AVENUE SUITE 200-611
LAS VEGAS, NV 89123
Assignment: 2
Reel/Frame:
061668/0819Recorded: 10/13/2022Pages: 9
Conveyance:
CHANGE OF NAME & ADDRESS
Assignor:
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Exec Dt:
07/29/2022
Assignee:
GIGADEVICE SEMICONDUCTOR INC.
NO.8, IC PARK, NO.9 FENGHAO EAST ROAD, HAIDIAN
BEIJING, CHINA 100094
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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