Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14152244
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Filing Dt:
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01/10/2014
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Publication #:
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Pub Dt:
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07/02/2015
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Inventors:
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Chun-Yang Tsai, Yu-Wei Ting, Kuo-Ching Huang
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Title:
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Metal Line Connection for Improved RRAM Reliability, Semiconductor Arrangement Comprising the Same, and Manufacture Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & ASSOCIATES, LLC. |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BANK BUILDING |
| CLEVELAND, OH 44114 |
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