Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14150683
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Filing Dt:
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01/08/2014
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Publication #:
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Pub Dt:
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07/09/2015
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Inventors:
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Dror Hurwitz, Alex Huang
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Title:
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Substrates With Ultra Fine Pitch Flip Chip Bumps
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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FOUNDERPCB INDUSTRY PARK |
QIANWU, DOUMEN |
ZHUHAI, CHINA 519173 |
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JONATHAN D. HALL |
WIGGIN AND DANA LLP |
ONE CENTURY TOWER, P.O. BOX 1832 |
NEW HAVEN, CT 06508-1832 |
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