Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14422351
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Filing Dt:
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02/18/2015
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Publication #:
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Pub Dt:
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07/23/2015
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Inventors:
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Keita Takada, Tadatoshi Danno, Toshiyuki Hata
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING CONNECTING SEMICONDUCTOR CHIP TO METAL PLATE VIA METAL RIBBON
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| MCGINN I.P. LAW GROUP, PLLC |
| 8321 OLD COURTHOUSE ROAD, SUITE 200 |
| VIENNA, VA 22182-3817 |
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