Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2016
|
Application #:
|
14677376
|
Filing Dt:
|
04/02/2015
|
|
Publication #:
|
|
Pub Dt:
|
07/30/2015
| | | | |
|
Inventors:
|
Mark C. Lamorey, Janak G. Patel, Peter Slota JR., David B. Stone
|
|
Title:
|
PACKAGES FOR THREE-DIMENSIONAL DIE STACKS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| WOOD, HERRON & EVANS, LLP (IBM-BUR) |
| 2700 CAREW TOWER |
| 441 VINE STREET |
| CINCINNATI, OH 45202 |
|
|
Search Results as of:
05/14/2024 02:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
