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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9607888
Issue Dt:
03/28/2017
Application #:
14613086
Filing Dt:
02/03/2015
Publication #:
20150221550
Pub Dt:
08/06/2015
Inventors:
Toshio Hasegawa, Manabu Oie, Steven Consiglio, Kaoru Maekawa, Kai-Hung Yu et al
Title:
INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
Assignment: 1
Reel/Frame:
034947/0001Recorded: 02/12/2015Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YU, KAI-HUNG
Exec Dt:
02/04/2015
HASEGAWA, TOSHIO
Exec Dt:
02/12/2015
ISHIZAKA, TADAHIRO
Exec Dt:
02/10/2015
OIE, MANABU
Exec Dt:
02/04/2015
AMANO, FUMITAKA
Exec Dt:
02/06/2015
CONSIGLIO, STEVEN
Exec Dt:
02/10/2015
WAJDA, CORY
Exec Dt:
02/09/2015
MAEKAWA, KAORU
Exec Dt:
02/04/2015
LEUSINK, GERT J.
Exec Dt:
02/10/2015
Assignee:
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER
3-1 AKASAKA 5-CHOME
MINATO-KU, TOKYO, JAPAN 107-6325
Correspondent:
TOKYO ELECTRON U.S. HOLDINGS, INC.
2400 GROVE BLVD.
AUSTIN, TX 78741

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