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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
14183291
Filing Dt:
02/18/2014
Publication #:
Pub Dt:
08/20/2015
Inventors:
Cherngye Hwang, Stefan Maat, Charles G. Seegel III, Yunxiao Gao, Xavier C. Lelong et al
Title:
WAFER CLAMP FOR CONTROLLING WAFER BOWING AND FILM STRESS
Assignment: 1
Reel/Frame:
032741/0977Recorded: 04/23/2014Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/27/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
01/14/2014
Exec Dt:
01/25/2014
Exec Dt:
02/05/2014
Assignee:
HERIKERBERGWEG 238
LUNA ARENA
AMSTERDAM, NETHERLANDS 1101 CM
Correspondent:
ZILKA-KOTAB, PC
P.O. BOX 721120
SAN JOSE, CA 95172
Assignment: 2
Reel/Frame:
040829/0516Recorded: 12/06/2016Pages: 115
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/31/2016
Assignee:
3355 MICHELSON DRIVE, SUITE 100
IRVINE, CALIFORNIA 92612
Correspondent:
ANGELA REYES
5601 GREAT OAKS PARKWAY
ATTENTION: PATENT DEPARTMENT
SAN JOSE, CA 95119

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