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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/31/2016
Application #:
14423990
Filing Dt:
02/25/2015
Publication #:
Pub Dt:
08/27/2015
Inventors:
Tohru Matsumoto, Masaru Ogasawara, Mitsuaki Toda
Title:
Manufacturing Method of Device Embedded Substrate and Device Embedded Substrate Manufactured by this Method
Assignment: 1
Reel/Frame:
035040/0447Recorded: 02/26/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/15/2014
Exec Dt:
12/15/2014
Exec Dt:
12/08/2014
Assignee:
5-14-15, OGAMI
AYASE-SHI, KANAGAWA, JAPAN 252-1104
Correspondent:
MARSHALL, GERSTEIN & BORUN LLP
233 SOUTH WACKER
SUITE 6300
CHICAGO, IL 60606

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