Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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14198692
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Filing Dt:
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03/06/2014
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Publication #:
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Pub Dt:
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09/10/2015
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Inventors:
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Mark C. Lamorey, Janak G. Patel, Peter Slota Jr., David B. Stone
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Title:
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THERMALLY ENHANCED THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORP - ENDICOTT DRAFTING CENTER |
1000 RIVER STREET |
MAIL 972E |
ESSEX JUNCTION, VT 05452 |
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