Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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14314150
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Filing Dt:
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06/25/2014
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Publication #:
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Pub Dt:
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09/24/2015
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Inventor:
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Li-Cheng Shen
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Title:
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SYSTEM-IN-PACKAGE MODULE AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 188, WEN HWA 2ND RD. |
| KUEI SHAN HSIANG, TAO YUAN SHIEN, TAIWAN |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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