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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/07/2017
Application #:
14631745
Filing Dt:
02/25/2015
Publication #:
Pub Dt:
09/24/2015
Inventors:
Eung San Cho, Aida Abaca, Jobel A. Guanzon
Title:
Semiconductor Package with Integrated Die Paddles for Power Stage
Assignment: 1
Reel/Frame:
035039/0273Recorded: 02/26/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/26/2015
Exec Dt:
01/27/2015
Exec Dt:
01/27/2015
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MICHAEL FARJAMI
26522 LA ALAMEDA AVE., SUITE 360
MISSION VIEJO, CA 92691
Assignment: 2
Reel/Frame:
038463/0859Recorded: 04/13/2016Pages: 10
Conveyance:
MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/29/2015
Exec Dt:
09/29/2015
Newly Merged Entity Data
Exec Dt:
09/29/2015
Newly Merged Entity's New Name:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON
1255 CRESCENT GREEN, SUITE 200
CARY, NC 27518

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