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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/28/2016
Application #:
14223157
Filing Dt:
03/24/2014
Publication #:
Pub Dt:
09/24/2015
Inventors:
Wen Kun Yang, Yu-Hsiang Yang
Title:
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME
Assignment: 1
Reel/Frame:
032509/0346Recorded: 03/24/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/18/2014
Exec Dt:
03/18/2014
Assignee:
WICKHAMS CAY P.O. BOX 662 ROAD TOWN
TORTOLA, VIRGIN ISLANDS, BRITISH
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, P.C.
4000 LEGATO ROAD, SUITE 310
FAIRFAX, VA 22033
Assignment: 2
Reel/Frame:
056503/0697Recorded: 06/10/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/06/2021
Assignee:
1272 SUNRISE WAY
MILPITAS, CALIFORNIA 95035
Correspondent:
YEN JUNG SUNG
3047 37ST
ASTORIA, NY 11103
Assignment: 3
Reel/Frame:
066099/0117Recorded: 01/11/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/03/2024
Assignee:
NO.47, LANE 6, AN-KANG ST.
HSIN-CHU CITY, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
125 S. ROYAL ST.
ALEXANDRIA, VA 22314

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