Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2017
|
Application #:
|
14581624
|
Filing Dt:
|
12/23/2014
|
|
Publication #:
|
|
Pub Dt:
|
10/29/2015
| | | | |
|
Inventors:
|
Hirokazu OKADA, Hiroshi URAGAMI, Tsuyoshi AMAKAWA, Muneo MIURA
|
|
Title:
|
METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, RESIN-ENCAPSULATED ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 601-8105 |
|
|
|
|
| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
|
|
Search Results as of:
05/02/2024 01:48 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
