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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/20/2018
Application #:
14763150
Filing Dt:
07/23/2015
Publication #:
Pub Dt:
11/12/2015
Inventors:
Jun MATSUDA, Takayuki SUZUKI, Masami KURODA
Title:
HEAT-BONDING APPARATUS AND METHOD OF MANUFACTURING HEAT-BONDED PRODUCTS
Assignment: 1
Reel/Frame:
036639/0120Recorded: 09/23/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/01/2015
Exec Dt:
07/01/2015
Exec Dt:
07/01/2015
Assignee:
18-1, TAKADA 1-CHOME, TOSHIMA-KU
TOKYO, JAPAN 171-8555
Correspondent:
SQUIRE PATTON BOGGS (US) LLP
275 BATTERY STREET, SUITE 2600
SAN FRANCISCO, CA 94111
Assignment: 2
Reel/Frame:
046352/0407Recorded: 06/13/2018Pages: 2
Conveyance:
CHANGE OF ADDRESS
Assignor:
Exec Dt:
05/02/2018
Assignee:
3-3-27, SAKAWA, SAKURA-KU
SAITAMA-SHI
SAITAMA, JAPAN 338-0823
Correspondent:
SQUIRE PATTON BOGGS (US) LLP
1801 PAGE MILL ROAD, SUITE 110
PALO ALTO, CA 94304

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